主要学术成果（论文、专利、专著、译著等） |
著作章节: 1. C Liu, P Chen*. Simulation of force, energy, and surface integrity during nanometric machining by molecular dynamics in Machining and Tribology, editor. Alokesh Pramanik, Elsevier, Amsterdam, Netherlands，2021，Chapter 7. ISBN：9780128198896. 2. P Chen and S-C Wong*. Polymer nanocomposites reinforced with carbonaceous nanofillers and their piezoresistive behavior in Physical properties and Applications of polymer nanocomposites, editor. S-C Tjong, Y-W Mai, Woodhead Publishing Limited, Cambridge UK, 2010. Chapter 11:404-427. ISBN: 9781845696726. 近五年主要期刊论文：（发表SCI论文30余篇，谷歌学术引用超1200次） 1. F Qin, L Zhang, P Chen*, T An, Y Dai, Y Gong, Z Yi, H Wang. In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process. Mechanical systems and signal processing, 2021, 154, 107550. 2. X Li, P Chen*, F Qin, X Dong, Q Xu*. Bionic PDMS-CDs surface with thermal controllable adhesion. Materials Letters, 2020, 263 (15), 127267. 3. P Chen, X Li, J Ma, R Zhang, F Qin, J Wang, TS Hu, Y Zhang, Q Xu*. Bioinspired photodetachable dry self-cleaning surface. Langmuir, 2019, 35(19), 6379-6386. 4. P Chen*, Z Zhang, C Liu, T An, H Yu, F Qin. Temperature and grain size dependences of mechanical properties of nanocrystalline copper by molecular dynamics simulation. Modelling and Simulation in Materials Science and Engineering, 2019, 27 (6), 065012. 5. L Zhang, P Chen*, T An, Y Dai, F Qin*. Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process. Current Applied Physics, 2019, 19 (5): 570-581. 6. P Chen*, Z Zhang, T An, H Yu, F Qin. Generation and distribution of residual stress during nano-grinding of monocrystalline silicon. Japanese Journal of Applied Physics, 2018, 57(12): 121302. 7. Z Zhang, P Chen*, F Qin, T An, H Yu. Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation. AIP Advances, 2018, 8: 055223. 8. J Sun, P Chen*, F Qin, T An, H Yu, B He. Modelling and experimental study of roughness in silicon wafer self-rotating grinding. Precision Engineering, 2018, 51: 625-637. 9. J Sun, F Qin*, P Chen* and T An. A predictive model of grinding force in silicon wafer self-rotating grinding. International Journal of Machine Tools and Manufacture, 2016, 109: 74-86. |
