主要学术成果（论文、专利、专著、译著等） |
截至2021年7月，在力学、微电子封装技术类权威期刊发表期刊论文20余篇，国际会议论文30余篇，出版译著2部，已申请或授权专利、软件著作权10余项。 代表性SCI期刊论文： [1] ZHAO Jingyi, AN Tong*, FANG Chao, BIE Xiaorui, QIN Fei*, CHEN Pei, DAI Yanwei. A study on the effect of microstructure evolution of the aluminum metallization layer on its electrical performance during power cycling. IEEE Transactions on Power Electronics, 2019, 34(11): 11036-11045. (中科院一区TOP, JCR分区Q1) [2] QIN Fei, BIE Xiaorui, AN Tong*, DAI Jingru, DAI Yanwei, CHEN Pei. A lifetime prediction method for IGBT modules considering the self-accelerating effect of bond wire damage. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021, 9(2): 2271-2284. (中科院二区, JCR分区Q1) [3] QIN Fei, ZHAO Jingyi, AN Tong*, Dai Jingru, DAI Yanwei, CHEN Pei. Effect of crack evolution on the resistance and current density of the Al metallization in the IGBT module during power cycling. IEEE Transactions on Device and Materials Reliability, 2020, 20(4): 706-715. [4] AN Tong, QIN Fei*, ZHOU Bin*, CHEN Pei, DAI Yanwei, LI Huaicheng, TANG Tao. Vibration lifetime estimation of PBGA solder joints using Steinberg model. Microelectronics Reliability, 2019, 102: 113474. [5] AN Tong*, FANG Chao, QIN Fei, LI Huaicheng, TANG Tao, CHEN Pei. Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectronics Reliability, 2018, 91: 213-226. [6] AN Tong*, QIN Fei, CHEN Si, CHEN Pei. The effect of the diffusion creep behavior on the TSV-Cu protrusion morphology during annealing. Journal of Materials Science: Materials in Electronics, 2018, 29(19): 16305-16316. [7] CHEN Si, AN Tong*, QIN Fei, CHEN Pei. Microstructure evolution and protrusion of electroplated Cu filled in through silicon vias subjected to thermal cyclic loading. Journal of Electronic Materials, 2017, 46(10): 5916-5932. (被评为美国TMS协会FMD/JEM 2017年度最佳论文) [8] WU Wei, QIN Fei, AN Tong*, CHEN Pei. A study of creep behavior of TSV-Cu based on nanoindentaion creep test. Journal of Mechanics, 2016, 32(6): 717-724. [9] CHEN Si, QIN Fei*, AN Tong*, CHEN Pei, XIE Bin, SHI Xunqing. Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectronics Reliability, 2016, 63: 183-193. [10] 陈思, 秦飞, 安彤*, 王瑞铭, 赵静毅. 退火工艺对硅通孔填充Cu微结构演化与胀出行为的影响. 金属学报, 2016, 52(2): 202-208. [11] WU Wei, QIN Fei, AN Tong*, and CHEN Pei. Experimental and numerical investigation of mechanical properties of electroplating copper filled in through silicon vias. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(1): 23-30. [12] AN Tong*, QIN Fei. Relationship between the intermetallic compounds growth and the microcracking behavior of lead-free solder joints. Transactions of the ASME, Journal of Electronic Packaging, 2016, 138: 011002 (10 pages). |
